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Voipac - The Embedded Professionals

NEWS ARCHIVE

12/2/13
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i.MX53 SODIMM Module Price Cut
We are pleased to announce that due to the high interest of Voipac customers in i.MX53 SODIMM Module, we were able to optimize its manufacturing costs and cut our prices in average by 25% for the high-end MAXimum, and 15% for the PROfessional and BASIC configuration SODIMM Module. Check our new pricelist.
10/2/13
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New format i.MX6Q Single Board Computer
Voipac continues to expand it's Freescale based COMs family and has become certified partner for the new i.MX6 based project! The new i.MX6 Rex Module targeting skilled development teams demanding high computing power and high speed peripherals will be available in Q4 2013. Complete Altium Designer project documentation of the development kit including schematic, PCB and BOM of both the Base Board and SBC itself is free and available at the iMX6 Rex site. More about the availability and pricing.
8/27/13
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New product design and development training service
Reacting to the increasing demand for rapid development and the challenges you face during your own product design, we would like to share our knowledge and the know-how gained over the last 17 years in the field of designing systems with SBC. VOIPAC's new Design and Development Training Service starts from September 1st and helps you to design and deliver your products on time. For more information contact: [email protected].
4/17/13
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Windows Embedded Compact 7 Image and BSP for i.MX53 SODIMM SBC
Voipac released the beta version of the Board Support Package for Microsoft Windows Embedded Compact 7 for the i.MX53 SODIMM Module. This release brings initial WEC7 support for the i.MX53 SODIMM Module in Basic configuration and capacitive multitouch EDT display. The list of currently supported peripherals: SGTL5000 audio, LAN8700 Ethernet, microSD socket, Serial console, HID support for keyboard and mouse, USB memory stick, VGA output 640x480 16bit 60Hz, EDT capacitive touch panel supported. Please visit the Downloads section of our website for the free beta version of BSP for the WEC7.
3/18/13
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Voipac Computers On Module at the Amper fair
We invite you visit booth no. F 024 of our Czech distributor SOS electronic at the Amper exhibition in Brno, Czech Republic, presenting various Voipac computers on module, including the latest i.MX53 based SODIMM Module running Android 2.3.
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Last update: December 02, 2013