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The module provides all of the must-have peripherals of a standard embedded system and moreover includes multiple development demanding parts soldered right on the COM, such as: dual 1Gb Ethernet PHY + Audio chip + EEPROM memory + WiFi and Bluetooth module, thus significantly reduces new product time-to-market.

This is a passive-cooled solution, delivering an exceptional thermal performance without efficiency sacrifice, ideal for battery-powered applications where heatsink usage is not possible.

Three robust, 100-pin, shielded connectors with wide mating length and operating temperature range provide perfect board-to-board connection for demanding applications. These connectors with 3mm stacking height feature shielding metal fittings along the connector signal pins, both on the module and the baseboard, ideal for a stable-performance embedded system as well as for conformal coating.

Furthermore, to ensure this i.MX 93 COM / SOM fits into your final device, its design was compressed into less than 2/3 of a credit card surface area, 1.6mm thin, HDI micro-via Level III, 10-layer PCB.

The confidential schematic of the iMX93 Industrial Module in PDF, providing answers to engineering questions, is also included in complete development kit, and becomes available right after the development kit purchase.

• NXP i.MX 93 ARM® Cortex®-A55 Cortex-M33 Ethos™-U65 Dual CPU, 1.7GHz

• eMMC Flash 16GB

• 1GB LPDDR4-3733 SDRAM (1.866GHz)

• WiFi 4 and Bluetooth 5.2 on module

• Analog audio on module

• 2x 10/100/1000 Mbps Ethernet

• 1Mbit I2C EEPROM

• User LED, power LED

• 3x 100-pin shielded board-to-board connector

• 0°C to +70°C Commercial temperature range

• Yocto 4.2 (Mickledore) (Linux version 6.1.22) preinstalled on eMMC Flash

• MAC address preset, virgin e-Fuses

• Lead free, REACH / RoHS compliant

• i.MX 8M Solo / Dual NXP ARM® Cortex®-A55 Cortex-M33 Ethos™-U65 CPU, clocked up to 1.7GHz

• eMMC Flash 4 / 8 / 16 / 32 / 64GB

• LPDDR4(X)-3733 (1.866GHz) SDRAM 512 / 1024 / 2048 MB

• WiFi on module (802.11 a/b/g/n/ac/ax 2.4 and 5GHz)

• Bluetooth on module (Bluetooth 5.3)

• Analog stereo audio on module

• 2x 10/100/1000 Mbps Ethernet

• I2C EEPROM 1Mbit

• 2x USB 2.0 host/device

• LVDS (up to 720p 1280x720 at 60Hz)

• MIPI-DSI (up to 1080p 1920x1080 at 60Hz)

• video input MIPI-CSI2 (up to 1080p 1920x1080 at 60Hz)

• 1x NAND Flash (8bit)

• 1x SD (4bit)

• 2x CAN-FD

• 4x 12-bit analog-to-digital converter (ADC)

• 1x Octal SPI, 8x SPI

• 8x UART

• 7x I2S, 2x I3C, 8x I2C

• PDM mic, MQS output, SPDIF

• SAI, GPIO and PWM

• WiFi & Bluetooth indicator signals

• configurable signals as GPIOs

• System signals: Reset IN/OUT, ON/OFF, 4x Boot mode, Power OK, User button

• JTAG

• User LED on module, power LED on module

• 3x 100-pin shielded board-to-board connector

• 2x mounting holes with 3.1mm diameter and 7.8mm wide clearance

• Dimensions: 60 x 47 x 6.20mm

• Input power: +5V DC

• Commercial / Extended / Industrial temperature range

• Yocto Project Linux distribution preinstalled

• Lead free, REACH / RoHS compliant

Besides the 4 standard configurations, the module hardware configuration, preinstalled software, e-Fuses boot device setting, and other features can be customized without any processing surcharge (MOQ: 10+ pcs).

For batches exceeding 100pcs, Voipac provides free service of the customer's own boot loader preloading prior to the order dispatch.

For outdoor applications, iMX93 Industrial Module Pro is available also in -20°C to +70°C Extended temperature range or in -40°C to +85°C Industrial temperature range.

The i.MX 93 CPU belongs to the group of CPUs included in the NXP Product Longevity Program, that guarantees a minimum availability period of 15 years for all market segments.

This product is supported by standard end-of-life Voipac notification policy.